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Hexafluoro-1,3-butadiene (C4F6) is an environmentally friendly dry etching gas with low GWP, high etching rate, high selectivity and high aspect ratio, showing very high performance for critical plasma etching in semiconductor devices manufacturing.
Chemical Name | Hexafluoro-1,3-butadiene |
Synonyms | Perfluorobutadiene |
CAS # | 685-63-2 |
ELINCS # (EU) | 211-681-0 |
Molecular Formula | C4F6 |
Structure | CF2=CF-CF=CF2 |
Chemical Name | Hexafluoro-1,3-butadiene |
Molecular Weight | 162 |
Boiling Point(℃) | 6 |
Vapor Pressure (bar, @0℃) | 19.65 |
Critical Temperature(℃) | 136.75 |
Critical Pressure (kPa) | 3131 |
Liquid Density (g/ml) | 1.553 |
GWP (100 Years) | < 1 |
ODP | 0 |
Purity | 99.9% | 99.99% |
Cylinder Size | Valve Type | Filling Weight |
10.2L | CGA 350 / DISS 724 | 10kg |
44L | CGA 350 / DISS 724 | 44kg |
47L | CGA 350 / DISS 724 | 47kg |
The global warming potential of C4F6 is less than 1, and has a much shorter lifetime in the atmosphere.
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