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Hexafluoro-1,3-butadiene (C4F6), also known as HFBD, is a colorless, odorless, flammable liquefied gas. As an environmentally friendly fluorine chemicals with low GWP, C4F6 has become one of the most advanced dry etching gases with a low C/F ratio and unsaturated bonds. C4F6 shows many application advantages in plasma, ion beam or sputter dry etching in semiconductor devices manufacturing.
The physical properties, package and shipping information for C4F6 are as follows.
Physical Data
Molecular Weight | 162 |
Boiling Point (℃) | 6 |
Vapor Pressure (bar, @0 ℃) | 19.65 |
Critical Temperature (℃) | 136.75 |
Critical Pressure (kPa) | 3131 |
Liquid Density (g/ml) | 1.553 |
GWP (100years) | 290 |
ODP | 0 |
Cylinder Data
Cylinder Size(L) | Fill Weight(kg) | Valve Outlet |
10.2 | 10 | CGA 350 |
47 | 47 | CGA 350 |
Specify CGA & Other cylinder connections are also available–please contact YUJI representative.
Shipping Information
DOT Name: Hexafluoro-1,3-butadiene
DOT Hazard Class: 2.1; Subsidiary Class: 2.1
UN No.: UN 3160
DOT Label: Liquefied gas, toxic, flammable, Inhalation Hazard Zone C
CAS No.: 685-63-2
Applications
Used as a dry etching gas in silicon-based integrated circuits
Application advantages:
Higher aspect ratio
Low C/F ratio and insaturations lead to narrow and deep grooves for processing at very narrow line widths (as narrow as 45-25nm)
Higher selectivity
Compared with octafluorocyclobutane (c-C4F8), C4F6 is sensitive to silicon dioxide over photoresist, silicon substrate or nitride film. Only the dielectric substrate can be etched.
Less VOC emissions
The global warming potential of C4F6 is only about 0.1, resulting in a much shorter lifetime in the atmosphere.
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